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Compute Modules

TFNEW S230I2 AI Compute Module

Model: S230I2 · SKU: 0201005

S230I2: an AI compute module with 20 TOPS INT8 AI compute (10 TFLOPS FP16), 12 GB LPDDR4X memory, H.264/H.265 hardware decode and JPEG encode/decode, in a wide-temperature design (-20°C ~ +85°C).

Reference configuration

Configuration

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Integration

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WHY THIS PRODUCT

S230I2 AI Compute Module — Enterprise Server Platform

The S230I2 is an AI compute module with 20 TOPS INT8 AI compute, 12 GB LPDDR4X memory and H.264/H.265 hardware decode support.

High-Density Computing

20 TOPS INT8 AI compute to meet enterprise-grade workload requirements.

Flexible Storage Expansion

Equipped with LPDDR4X 12/8/4 GB memory for elastic scaling of business data.

Enterprise Reliability

Wide-temperature design (-20°C ~ +85°C) ensures stable operation in harsh environments.

Specifications

AI Compute20 TOPS INT8, 10 TFLOPS FP16 / 8 TOPS INT8, 4 TFLOPS FP16
MemoryLPDDR4X, 12/8/4 GB, total bandwidth 51.2/34.1/34.1 GB/s, ECC support; built-in SPI flash, 64 MB
StorageExternal MMC interface; external SATA interface; H.264/H.265 hardware decoder, 40x 1080P 30 FPS
CodecJPEG decode 1080P 512 FPS, encode 1080P 256 FPS, max resolution 16384x16384; HEIF decode 1080P 480 FPS
Operating Voltage12V
PowerTypical power consumption: S230I2: 32W
Operating Temperature-20°C ~ +85°C
Dimensions82 L x 60 W x 7 H (mm)
SKU0201005
Warranty-
Lead time-

Applications

Built for Real Business Workloads

Use this platform as part of a complete enterprise AI infrastructure solution.

AI Training and Inference

A high-performance compute node supporting private model training, inference and concurrent workloads.

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Private Compute Infrastructure

Serves as the compute foundation of enterprise data centers for virtualization and hyper-converged scenarios.

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HPC and Data-Intensive Workloads

High-throughput I/O and low-latency interconnect for scientific computing, engineering simulation and data analytics.

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Deployment

A Clear Deployment Path

Move from requirement discovery to a validated configuration and supported delivery.

1

Requirements and Specification Review

Confirm key parameters such as compute selection, power consumption, storage and facility environment.

2

Configuration and Compatibility Validation

Validate PCIe topology, thermal airflow and full-load system stability.

3

Delivery and Technical Support

Provide factory test reports, environment pre-installation and full lifecycle technical support.

Resources

Project Resources

Request the current documents for the exact configuration your team is evaluating.

Product Datasheet

Review detailed technical specifications, dimensions and interface definitions.

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Installation and Configuration Guide

Best practices for rack mounting, cabling and data center deployment.

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Technical Consulting

Discuss customized solutions with TF NEW senior hardware engineers.

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REQUEST A QUOTE

Get a Configuration and Quote for the S230I2 AI Compute Module

Tell us about your required configuration scale and deployment timeline, and we will provide professional advice and a formal quotation.

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